Soft magnetic materials are undergoing iterative upgrades, unlocking new avenues for high-frequency, miniaturized inductor products!
2025-12-04 13:44
Since its industrial debut in the late 19th century, soft magnetic materials have undergone five generations of evolution—starting with silicon steel sheets, progressing to soft magnetic alloys, ferrites, amorphous/nanocrystalline ribbons, and culminating in soft magnetic composites (magnetic powder cores). Each technological leap has driven electronic devices toward higher performance, smaller form factors, and operation at higher frequencies. Among these advances, soft magnetic composites (magnetic powder cores), with their core advantages of low loss and high saturation flux density, have emerged as the optimal solution for today’s high‑frequency, high‑power applications. By coating the surfaces of magnetic powder particles with an insulating layer and then compacting them via powder metallurgy, these materials strike an ideal balance between magnetic properties and manufacturability, providing critical support for breakthroughs in inductor technology.
Soft magnetic materials— the “magnetic core” of electronic components— are driving innovation in inductor technology.
Soft magnetic materials, as critical foundational materials for the electronics industry, are extensively used in core components such as inductors, filters, switch-mode power supplies, and transformers, serving as the “invisible cornerstone” that ensures the efficient operation of electronic devices.
Since its industrial application began in the late 19th century, soft magnetic materials have undergone five generations of evolution—starting with silicon steel sheets, progressing to soft magnetic alloys, ferrites, amorphous/nanocrystalline ribbons, and finally to soft magnetic composites (magnetic powder cores). Each technological leap has driven electronic devices toward higher performance, smaller form factors, and operation at higher frequencies. Among these advances, soft magnetic composites (magnetic powder cores), with their core advantages of low loss and high saturation flux density, have emerged as the optimal solution for today’s high‑frequency, high‑power applications. By coating the surfaces of magnetic powder particles with an insulating layer and then compacting them via powder metallurgy, these materials achieve an excellent balance between magnetic properties and manufacturability, providing critical support for breakthroughs in inductor technology.

▲History of Soft Magnetic Materials
Magnetic‑powder‑core inductors—three major product portfolios, covering all application scenarios.
Based on the characteristics of magnetic powder‑core materials, inductor products have adopted a diversified portfolio—comprising traditional wire‑wound inductors, monolithic molded inductors, and EI‑type molded inductors—to meet the diverse needs of various application fields.
◆Traditional wire-wound inductor:
Deeply cultivating mature markets such as household appliances, data centers, energy storage, photovoltaics, and new‑energy vehicles constitutes the core foundational components that ensure the stable operation of the industry.
◆Monolithic inductor:
In recent years, this star product has experienced explosive growth, leveraging its integrated structural advantages to deliver outstanding performance in high-frequency, high-current applications, thereby becoming an essential component across sectors such as 5G, new-energy vehicles, and consumer electronics.
◆EI integrated molded inductor:
Driven by server manufacturers’ demands for cost reduction and efficiency improvement, the TLVR concept has emerged. With a compact footprint, it reduces heatsink volume by 30% and PCB area by 41%, thereby significantly enhancing equipment integration. The monolithic EI‑type inductor, with its rapid transient response and ability to lower the number of downstream capacitors—thus cutting costs—has earned widespread industry acclaim.
Market Dynamics and the Rise of Domestic Brands: Tongyou Group’s Three‑Pronged Path to Breaking the Impasse
The global monolithic inductor market is highly concentrated, with Taiwanese companies long holding the leading position; however, domestic manufacturers are rapidly gaining ground. Companies such as Majie Technology, Sunlord Electronics, and Fenghua High-Tech are all stepping up their investments and expanding their presence. Meanwhile, Tongyou Group has achieved leapfrog growth thanks to its unique “materials‑equipment‑products” integrated strategy—spanning core magnetic powder material R&D, independent production equipment development, and mass production of finished inductor products. This end-to-end industrial-chain layout gives the company a competitive edge in both technological advancement and capacity expansion. Currently, it has reached a monthly production capacity of 120 million monolithic inductors, firmly establishing itself among the top tier of domestic players.


Meanwhile, Fenghua High-Tech is ramping up production through technological upgrades and capacity expansion, while Sunlord Electronics has begun mass‑producing new products. Domestic manufacturers are leveraging technological innovation and manufacturing‑capacity advantages to steadily capture global market share. With the rapid growth of emerging technologies such as 5G, new energy, and AI, demand for integrated molded inductors is expected to continue rising, leaving ample room for domestic substitution.
The Next-Generation Track—Chip Inductors—Kicks Off High-End Competition
As the “next‑generation core product” in the inductor market, chip inductors are still predominantly made from ferrite materials. However, metal soft magnetic powder cores, with their superior magnetic performance, are seeing rapidly increasing adoption. Although these components involve more complex manufacturing processes and currently struggle to match the miniaturization advantages of monolithic inductors, they remain indispensable in high‑power, low‑loss applications, making them a critical battleground for leading manufacturers.
Tongyou Group has proactively invested in the R&D of EI‑integrated molded inductors and has successfully developed VR, dual‑VR, and TLVR products. These devices offer advantages such as low voltage operation, high current capability, and low DC resistance. Compared with conventional inductors, they not only deliver lower power consumption, higher conversion efficiency, and longer service life but also feature rapid transient response, effectively reducing power‑supply ripple and precisely meeting the stringent requirements of high‑end servers and other equipment that demand stable power delivery and exceptional energy efficiency.
From technological breakthroughs in magnetic‑powder core materials to the iterative upgrades of inductor products, the development of soft magnetic materials and the inductor industry has consistently advanced in tandem. Tongyou Group will continue to leverage its end-to-end advantages—spanning materials, equipment, and finished products—to deepen its expertise in soft magnetic materials and inductors, helping China’s electronic components move toward high‑end applications and global markets, and injecting powerful “magnetic” momentum into the growth of emerging industries.
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