With an annual output value of RMB 1.05 billion, the Tongyou Intelligent Manufacturing R&D Headquarters project is accelerating construction and is expected to begin production in January next year.
2025-07-02 10:01
The smart manufacturing R&D headquarters project of Tongyou Intelligent Equipment (Jiangsu) Co., Ltd. is currently undergoing foundation pile construction. Workers are systematically advancing according to the schedule and implementing each construction milestone, with completion and commissioning expected by January 2026.
On February 18, the reporter visited the High-End Equipment Headquarters Industrial Park in Kunshan High-Tech Zone and observed that,
The smart manufacturing R&D headquarters project of Tongyou Intelligent Equipment (Jiangsu) Co., Ltd. is currently undergoing foundation pile construction. Workers are systematically advancing according to the schedule and implementing each construction milestone, with completion and commissioning expected by January 2026.

According to Director Chen of Tongyou Intelligent, the headquarters project is situated on a 18-mu site with a total floor area of approximately 32,000 square meters. With a total investment of RMB 550 million, the project will primarily comprise an R&D center, a testing center, production workshops, and a product exhibition hall. Upon completion, it will house a state-of-the-art ultra‑miniature integrated‑molding inductor production line capable of an annual output of 3 billion units, achieving an annual output value of RMB 1.05 billion once operational.

As one of the three major passive components, inductors are often referred to as “energy buffers” in the electronics world, exhibiting the characteristic of passing DC while blocking AC. They find extensive applications in consumer electronics, automotive electronics, and other fields. Founded in 2017, Tongyou Intelligent has, within just a few years, become a well‑known enterprise in China’s inductor manufacturing and smart equipment sectors, thanks to its robust core technologies and superior product quality. The company pioneered an ultra‑miniature integrated molding inductor manufacturing process in China, breaking the reliance on imported hot‑pressing equipment for monolithic inductors and addressing a critical gap in the production of essential foundational components. “Our products boast excellent electrical performance, superior shielding, and a broad operating frequency range—exceeding 5 MHz—placing us at the forefront of the domestic market and earning widespread favor in mid‑to‑high‑end smart devices,” added Director Chen of Tongyou Intelligent. Currently, the company has achieved fully mechanized, automated production across key processes—including mold pressing, wire winding, hot‑pressing nanocrystalline powder, applying insulating and anti‑corrosion coatings, and laser cutting—enabling it to manufacture inductors of diverse specifications that cover virtually all application needs. In addition, the company offers customized development services to meet customers’ specific requirements.

It is precisely because of Tongyou Intelligent’s strong technological innovation capabilities, superior product quality, extensive industry experience, and rapid, responsive service that the company has established partnerships with numerous industry leaders and well-known brands. Its customers include Huawei HiSilicon, Fenghua High-Tech, Mingpu Opto‑Magnetic, Xinwei Communication, CETC Institute 9, DJI, Transsion Holdings, Xiaomi, Google, Microsoft, Samsung, and others. Its products are widely used in consumer electronics, 5G communications, the Internet of Things, new‑energy vehicles, military electronics, aerospace, and other fields. The company has been recognized as a National High‑Tech Enterprise, a national-level “Little Giant” enterprise specializing in niche markets, a Suzhou Gazelle Enterprise, and a four‑star cloud‑enabled enterprise in Jiangsu Province. It operates the Kunshan City Engineering Technology Research Center and is a recipient of the Gusu Innovation and Entrepreneurship Leading Talent Program. “Some of our ultra‑miniature integrated molded inductors have already earned Gold‑Level certification on Qualcomm’s flagship platform, and they are expected to be deployed on a large scale in next‑generation high‑end chips,” said Director Chen of Tongyou Intelligent.
“As we accelerate the construction of our headquarters project, we will also continue to secure orders, steadily ramp up production, and expedite delivery schedules. Meanwhile, efforts to upgrade and modernize our technologies and to develop new products will proceed at full speed, with the goal of achieving independent control over cutting-edge foundational materials, intelligent manufacturing equipment, and core technologies for advanced product processes as soon as possible.” With great anticipation, Tongyou Intelligent’s xx stated that, in the future, the establishment of a high‑standard smart manufacturing facility and the upgrading of its R&D center will lay a solid foundation for the development of new products and the expansion of manufacturing capacity.

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